Vasilis F. Pavlidis

University of Manchester, United Kingdom


Vasilis F. Pavlidis received the Diploma and MEng degrees from the Democritus University, Xanthi, Greece, in 2000 and 2002, respectively. He also received the MSc and PhD degrees from the University of Rochester, Rochester, NY, in 2003 and 2008, respectively, all in Electrical and Computer Engineering. From 2008-2012, he was a post-doctoral researcher with the Integrated Systems Laboratory directed by Prof. Giovanni De Micheli at EPFL, Lausanne, Switzerland. Since 2012, he has been a Lecturer within the Advanced Processor Technologies group at the School of Computer Science, of the University of Manchester. His current research interests include the area of interconnect modeling, 3-D integration, networks-on-chip, and related design issues in VLSI. He is the co-creator of the “Rochester cube” and co-author of the book “Three dimensional integrated circuit design”. His research activities are funded by EPSRC, EC-H2020, and ARM with which he closely collaborates.


Challenges and Opportunities in 3-D IC Stacking

Three-dimensional integration has been an exciting research topic for the past few years, primarily due to its potential to constitute another avenue for continuing microelectronics evolution. Recently, 3-D memory stacks have become available signaling the high volume manufacturing of stacked chips. We believe that the full potential of this technology can only be exploited by constructing heterogeneous systems that combine dissimilar technologies and support multiple functions with extremely low form factors. This talk offers a broad overview of 3-D integration and relating design issues for stacked systems. Emphasis is placed on challenges that must be surmounted to enable the harmonious symbiosis of disparate components in a multi-tier stack.