Ravinder Dahiya

University of Glasgow, UK


Ravinder Dahiya is Reader and EPSRC Fellow in the School of Engineering at University of Glasgow, UK. His Bendable Electronics and Sensing Technologies (BEST) group conducts fundamental research on flexible electronics using high-mobility materials, with an orientation towards robotics. 

His multidisciplinary research interests include Flexible and Printable Electronics, Electronic Skin, Robotic Tactile Sensing, and wearable electronics. He has published more than 100 research articles, 1 book (3 others at various publication stages) and 4 patents (including 2 submitted). He has worked on and led many international projects funded by European Commission and EPSRC (Engineering and Physical Sciences Research Council). 

He is on the Editorial Boards of IEEE Transactions on Robotics and IEEE Sensors Journal and has been guest editor of 4 Special Journal Issues. He represents IEEE Robotics and Automation Society in the Administrative Committee (AdCom) of IEEE Sensors Council. He was General Chair of IEEE PRIME 2015 and is the Technical Program Chair of IEEE Sensors 2017.  He established and now leads the UKRI chapter of IEEE Sensor Council. 

Dr. Dahiya holds prestigious EPSRC Fellowship and also received Marie Curie Fellowship and Japanese Monbusho Fellowship. He was awarded with the University Gold Medal and received 2 best paper awards and 2 second best paper awards (as co-author) IEEE international conferences. 


Conformable, Foldable Electronics

The microelectronics technology and subsequent miniaturization that began almost immediately after the transistor was invented have revolutionized our lives through fast computing and communication. Flexible and conformable electronics is widely considered to bring another such revolution by advancing many emerging applications such as wearable electronics and healthcare. A sensitive electronics system on large areas is another aspect of this burgeoning field, which will open new avenues such as intelligent robotics enabled by conformable electronic skin. All these applications require electronics on substrates such as plastics, which bend. In this lecture, I will present the developments related to flexible electronics, especially in context with realizing high-performance electronic skin for robotics. The development of electronic skin with solutions ranging from integration of off-the-shelf sensors and electronic components on flexible printed circuit boards (PCB) to emerging novel approaches involving silicon nanowires will be presented.